High heat dissipation board - List of Manufacturers, Suppliers, Companies and Products

High heat dissipation board Product List

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High thermal conductivity substrate "Copper Inlay Substrate"

High thermal conductivity substrate "Copper Inlay Substrate"

We provide a substrate embedded with copper coins to efficiently dissipate heat.

Among the diversifying electronic components, there are those that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, Sanwa Electronic Circuit offers substrates embedded with copper coins. These are ideal for applications such as power supply boards and high-frequency boards. 【Features】 ○ Solutions for heat dissipation measures (enhanced heat dissipation effect and improved design flexibility) ○ Heat dissipation measures for high heat-generating elements → Various copper-inlay substrates can be adopted, ranging from 2-layer to high-multilayer boards. For more details, please contact us or download the catalog.

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High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

High thermal conductivity substrate "Copper Inlay Substrate [Copper Coin]"

Efficiently dissipate heat from the back side with built-in copper coins! It is possible to reduce heat generation across the entire circuit board.

We would like to introduce our high thermal conductivity substrate, the "Copper Inlay Substrate [Copper Coin]." Among the diverse electronic components, there are some that generate a significant amount of heat during operation. To efficiently dissipate the heat from such electronic components, we offer substrates embedded with copper coins. [Features] - Efficiently dissipates heat to the backside by incorporating copper coins - Reduces overall heat generation of the substrate *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Thick copper substrate"

High thermal conductivity substrate "Thick copper substrate"

Using thick copper foil of 105μm or more! We provide substrates that enhance high current and heat dissipation.

We would like to introduce our high thermal conductivity substrate, the "Thick Copper Substrate." By increasing the copper thickness, it becomes possible to carry more current and improve heat dissipation. We provide substrates that enhance high current capacity and heat dissipation by using copper foil thicker than 105μm. 【Product Lineup】 ■ Double-sided Printed Circuit Boards ・Copper foil thickness: 70, 105, 140, 175μm ■ Multilayer Printed Circuit Boards ・Copper foil thickness (outer layer, inner layer): 70, 105μm *For more details, please refer to the PDF document or feel free to contact us.

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High thermal conductivity substrate "Metal base substrate"

High thermal conductivity substrate "Metal base substrate"

Used in products that require high heat dissipation, such as power boards and LED boards!

The "metal base substrate" is a high heat dissipation substrate made by laminating aluminum or copper. By using metals with high thermal conductivity, it is possible to efficiently dissipate heat from heat-generating components. Additionally, by changing the resist ink from a standard white to a white suitable for LEDs, a high reflectivity is achieved. This enables the production of high-brightness LED substrates. 【Product Lineup】 ■ Copper base substrate ■ Aluminum base substrate ■ Double-sided aluminum base *For more details, please refer to the PDF document or feel free to contact us.

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High-heat dissipation substrate "Bending Aluminum Base Substrate"

High-heat dissipation substrate "Bending Aluminum Base Substrate"

The intended use is for automotive decorative accessories, etc.! A thin aluminum base substrate with a thickness of 0.40mm.

We would like to introduce our high thermal conductivity substrate, the "Bendable Aluminum Base Substrate." Its features include flexibility similar to that of a flexible circuit, while also being able to maintain a bent shape, which is a significant advantage. It also possesses thermal conductivity as an aluminum base substrate. Please feel free to consult us when you need assistance. 【Features】 ■ Thickness: 0.40mm ■ Flexibility similar to that of a flexible circuit ■ Ability to maintain a bent shape ■ Possesses thermal conductivity *For more details, please refer to the PDF document or feel free to contact us.

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